News
ASU selected as home and partner for CHIPS and Science Act-funded national facility for semiconductor advanced packaging
January 6, 2025 | ASU News
In a victory for the entire state and a critical step forward for America’s efforts to reclaim its place as the global leader in digital technology, the U.S. Commerce Department and Natcast announced the selection of Arizona as the site of the co-located NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility.
Located at ASU Research Park in Tempe, adjacent to the university’s MacroTechnology Works building, the new facility will combine semiconductor research and prototyping for front-end manufacturing and packaging capabilities, meeting a unique need for advanced packaging R&D within the U.S. semiconductor ecosystem.
ASU and Mexico partner to build the next generation of chipmakers and drive semiconductor innovation
December 20, 2024 | Phoenix Business Journal
Thousands of college students in Mexico will soon have the opportunity to enroll in ASU’s new, free online course to learn the fundamentals of microelectronics and nanoelectronics.
Designed by ASU’s Ira A. Fulton Schools of Engineering and Global Launch, the new course is part of the university’s binational knowledge partnership with Mexico, which aims to advance North American competitiveness and ensure the global semiconductor supply chain meets demands for digital security and transformation worldwide.
Student research supports semiconductor sustainability
December 16, 2024 | ASU News
As microelectronics have become an increasingly essential part of modern society, greenhouse gas emissions have increased in tandem. Semiconductor manufacturing contributes 31% of greenhouse gas emissions worldwide, and a U.S. Department of Energy analysis estimates greenhouse gas emissions associated with semiconductors could quadruple by 2030.
But research efforts are underway to reduce the essential field’s environmental impact, thanks to a team of students in the Ira A. Fulton Schools of Engineering at ASU who are exploring ways to make microelectronics manufacturing more eco-friendly. Their research is sponsored by TSMC, which is garnering an increasing presence as part of the semiconductor industry’s rapid expansion in Arizona.
More about ASU microelectronics
Training stellar students to secure semiconductors
In ASU’s STAM Center, Michel Kinsy develops systems to protect vital microelectronics.
Read on Full CircleDepartment of State and ASU host Government Leaders Forum to strengthen semiconductor supply chains
The three-day forum convened leaders from Costa Rica, Vietnam and the Philippines to discuss workforce development and strategies for enhancing assembly, testing and packaging.
Read on ASU NewsASU awarded $100 million to improve the way semiconductors are packaged
A team led by ASU and Deca Technologies have qualified for up to $100 million in federal funds to drive innovation in semiconductor packaging.
Read on AZ Central$7 billion “city within a city” planned in Phoenix surrounding new TSMC fab
“Halo Vista,” as it is now known, will surround a manufacturing complex developed by TSMC—which is already under construction.
Read on NewsweekASU gets $2M NSF grant to supercharge the semiconductor industry
Sarma Vrudhula, an ASU professor of computer science and engineering, has been awarded a $2 million grant from the NSF to design a more efficient chip.
Read on ASU NewsHoneywell launches ‘innovation hub’ at ASU’s Tempe campus
Honeywell opened its Honeywell Innovation Hub on Sept. 30 — a new space on ASU’s Tempe campus launched in collaboration with Ira A. Fulton Schools of Engineering.
Read on Tempe Independent