Illustration of microelectronics packaging process

Advanced packaging is the next big thing in semiconductors — and no, we’re not talking about boxes

April 19, 2024 | ASU News

ASU is poised to be a major player in the next breakthrough in microchip technology: advanced packaging. The university is one of the few in the country that is teaching advanced packaging to its students, creating the skilled workforce that’s desperately needed by the semiconductor industry.

“ASU’s competitive advantage in advanced packaging stems from our scale, the innovativeness of our faculty and our partnerships, which extend both locally with companies like Deca Technologies, NXP and others, and farther afield,” said Zachary Holman, professor and vice dean for research and innovation.

Illustration of ASU-branded semiconductor

ASU is at the heart of the state’s revitalized microelectronics industry

April 25, 2024 | ASU News

Arizona now leads the nation in private-sector semiconductor investments, and ASU has been there every step of the way. Fueled by ASU, Arizona has transitioned from an economy based on its historic “5 C’s” to one centered on a sustainable high-tech industry

“Arizona is establishing itself as the epicenter of America’s semiconductor industry, and our universities are key to making that happen,” said Sandra Watson, president and CEO of the Arizona Commerce Authority.

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[VIDEO] The packaging play: The future of semiconductor innovation

April 23, 2024 | ASU News YouTube

ASU is at forefront of advanced packaging, the breakthrough microchip technology that combines multiple chips onto a single wafer to make them work faster with powerfully advanced capabilities.

A new Center for Advanced Wafer-Level Packaging Applications and Development, created in collaboration with Deca Technologies, will expand domestic semiconductor manufacturing and drive advancements in artificial intelligence, machine learning, automotive electronics and high-performance computing.

More about ASU microelectronics

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ASU and Deca Technologies partner on advanced packaging research and development

As America seeks to re-emerge as a world leader in semiconductor manufacturing, research and development, most experts agree that the next wave of innovation is advanced packaging.

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A top Biden administration official recently visited Arizona State University to activate a new agreement in which ASU will help boost America’s semiconductor capacity overseas.

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NSF announces new partners in ASU-led climate, economy initiative

The U.S. National Science Foundation has announced three new partners in an Arizona State University-led initiative to transform the desert Southwest’s climate challenges.

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DOD officials convene at ASU to learn about university-led microelectronics hub

Some of the top defense technology officials in the U.S. came to ASU to hear about the progress of the new Southwest Accelerated Prototyping Hub, led by ASU.

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