Southwest Advanced Prototyping (SWAP) Hub

Angelucci is a senior fellow at Lockheed Martin Rotary and Mission Systems, where he develops technical strategy for Lockheed Martin, particularly in the area of microelectronics. He specializes in complex electro-mechanical systems integration, microelectronics packaging and heterogeneous integration.

Bishop manages adaptive patterning technology, EDA development, intellectual property and R&D as chief technology officer at Deca Technologies. He is also technical director for the $100M SHIELD USA program and collaborates with ASU to produce leap-ahead organic substrates under the National Advanced Packaging Manufacturing Program.

Burkland facilitates the identification and creation of technologies to support innovative solutions for Raytheon business needs. A primary focus is directing development of advanced microelectronics technologies through Raytheon’s participation in the Semiconductor Research Corporation university research programs.

Fazzari is a senior technical advisor at Booz Allen Hamilton, where he provides guidance to DARPA and other government agencies on secure and trusted semiconductor technologies. He specializes in advanced circuit design, trusted fabrication, and hardware cybersecurity, with more than two decades of experience across the semiconductor design and manufacturing lifecycle.

Haddadin is a senior fellow and division chief technologist for broadband communication systems at L3Harris in Salt Lake City. With more than 27 years of industry experience, he specializes in digital signal processing, adaptive systems and advanced architectures. He holds a Ph.D. in electrical engineering from the University of Michigan.

Jha is a professor of practice at the University of Florida in Gainesville, with extensive experience in defense and communications. He previously served as a senior fellow at L3Harris, technical fellow at Raytheon and Boeing, and director at Qualcomm, and he has held executive roles at several high-profile startups.

Lin is the director of microelectronics science and technology at BAE Systems, where he leads strategic research and development efforts focused on advancing next-generation microelectronics. He specializes in science-driven technology innovation, systems integration, and bridging research with practical engineering solutions to support national security and commercial applications.

McCann is senior vice president and chief of staff for business units at Amkor Technology, where he supports strategy and operations for advanced packaging and manufacturing. He specializes in high-volume production, post-fab operations, and flip-chip assembly, bringing extensive leadership experience from across the global semiconductor industry.

McCormick previously led semiconductor technology strategy at Sandia National Laboratories within the Microsystems Engineering, Science, and Applications Center, where he directed CHIPS and Science Act partnerships and oversaw more than $70 million in production and research activities. His expertise spans semiconductor manufacturing, microsystems, and national laboratory R and D leadership. At Arizona State University, he serves as a special advisor to the SWAP Hub Chief Technology Officer.

Pereira co-founded Otava, where she serves as CEO and president. Before Otava, she spent 30 years leading design teams on state of the art module, hybrid and integrated circuit designs. She has five patents in reconfigurable analog data conversion and RF/Analog precision circuits as well as numerous publications.

Rebello is the senior technical fellow for microelectronics at The Boeing Company, where he leads the company’s strategy and investments in microelectronics. He is an expert in applying system-level methodologies and agile development processes to co-design software and hardware to enable advanced capabilities.

Sandhu is the director of the Manufacturing Science and Technology operating unit under Northrop Grumman’s Microelectronics Center. He is responsible for leading the strategy, capture and execution of multiple programs in the center, which include several key pursuits that will bolster national security.

Schleupen is a senior manager at the IBM T.J. Watson Research Center, where he leads research teams focused on advanced packaging, cooling, and electronics integration. He specializes in wafer-scale integration, chiplet packaging, and high-performance computing systems, with more than 30 years of experience advancing system-level and packaging innovation.

Trinh is the senior director in Mercury’s newly formed Advanced Concepts Group (ACG). He is responsible for aligning technology roadmaps with the evolving needs of the aerospace and defense industry, which includes strategic partnerships with the government, industry and academia to align product concepts with market and mission needs.