The SWAP Hub brings robust capabilities across all six focus areas of the Microelectronics Commons initiative and develops prototypes for national defense in three priority areas.

Priority areas

Artificial intelligence hardware

5G/6G wireless technology

Commercial leap-ahead technologies

Other capability areas

Electromagnetic warfare

Secure edge computing and the internet of things (IoT)

Quantum technology

Partner with the SWAP Hub

The SWAP Hub’s partners include top semiconductor manufacturers and defense firms, national laboratories, leading academic institutions and numerous organizations and innovative startup companies. Hub partners benefit from access to world-class facilities, advanced equipment and tools, and support from experts at ASU and across the SWAP Hub’s network. The Hub also offers access to calls for proposals on DoD-funded projects and unique opportunities for collaboration.

High fidelity execution and innovation

The SWAP Hub leverages ASU’s sophisticated, mature management systems for working with industry and DoD clients, as well as its extensive experience in managing large-scale federal projects and complex sub-awards. ASU ensures DoD and industry-level rigor in management of SWAP projects through a systems-based manufacturing approach and quality systems model that enables agility and innovation while guaranteeing fidelity and trusted, secure collaboration. Additionally, ASU maintains capabilities to carry out classified work, allowing the Hub to execute projects that require security clearance.

Split-fab innovation for end-to-end success

The SWAP Hub leverages a unique “split fab” relationship between Arizona State University and Sandia National Laboratories, enabling a unique synergy of capabilities. Sandia specializes in fabrication of radiation-hardened (Rad-Hard) CMOS wafers with front-end-of-line (FEOL) process steps at its Microsystems Engineering, Science and Applications Complex and Center for Integrated Nanotechnology, and ASU handles back-end-of-line (BEOL) processing customized for CMOS+X at its MacroTechnology Works semiconductor fab.

The SWAP Hub also leverages more than $500 million in investment from the private sector and the State of Arizona, including $270 million from ASU, Applied Materials and the Arizona Commerce Authority for the new Materials-to-Fab Center at ASU’s MacroTechnology Works.

ASU key capabilities

  • Macrotechnology Works (MTW) a 250,000 ft2 facility with 43,500 ft2 cleanroom, 22,000 ft2 wet/dry labs with substantial H6 capability
  • Materials-to-Fab Center (MTF), a groundbreaking partnership with Applied Materials bringing cutting edge industry tools
  • ASU Core Facilities for advanced research, consultation and project execution
  • Industry scale operations (300 mm tools up to 370 x 470 mm) to develop, characterize and optimize new materials and processes
  • Support offered by ASU’s experienced, professional engineering staff

Sandia key capabilities

World-class capabilities and expertise

The SWAP Hub applies cutting edge physical and virtual tools and world-class expertise across its workflow—from prototype design to demonstration—leveraging partner capabilities across six capability areas and driving performance across three cross-cutting themes.

Six unique capability areas


Materials for CMOS+X


Rad-Hard CMOS+X Integration


Heterogeneous Integration


Circuits, Architectures, and Test


Metrology and Characterization


Power and RF Electronics

Three cross-cutting themes

Trusted and Assured

The Hub’s project performers are committed to designing, testing, and validating the security and trust of microelectronics from IP design through fabrication, packaging, testing and distribution.

Rad-Hard/Extreme Environment Reliability

Going beyond conventional commercial approaches, the Hub’s projects address potential threats to electronics that operate in space and other extreme radiation environments to guarantee functionality and reliability.

Workforce Development

The Hub produces microelectronics talent tailored to DoD-identified needs through partnership with industry, higher education institutions and non-profit organizations.

Members and partners

Core partners provide capability across all Microelectronics Commons Hubs, including access to at-scale facilities with 300mm Si and 200mm compound capabilities

Capability partners provide capability to the SWAP Hub and its members, including access to hub facilities, equipment, software and expertise; <200mm/Si-based fab capabilities

SWAP Hub executive leadership team

Kyle Squires

Chief Executive Officer, SWAP Hub

Dean, ASU Ira A. Fulton Schools of Engineering

Jason Conrad

Chief Operating Officer, SWAP Hub

Krishendu Chakrabarty

Chief Technology Officer, SWAP Hub

Fulton Professor of Microelectronics, ASU School of Electrical, Computer and Energy Engineering

Benefits of engagement

Access ASU Core Facilities and faculty experts

Capability sharing with 130+ diverse Hub members

Teaming and funding opportunities, including on Microelectronics Commons and other CHIPS Act grants

Workforce development and employee upskilling

Exclusive networking events

Become a SWAP Hub member

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