The Materials for CMOS + X Technologies Capability specializes in producing cutting-edge semiconductors, such as MoS2 and WSe2, on 100mm and 200mm wafers at CMOS-compatible temperatures. Our mission is to seamlessly integrate these emergent materials with the CMOS platform, enhancing it with additional functionalities like spintronics, Rashbatronics, neuromorphics, and memristors. This integration aims to push beyond the current capabilities of traditional CMOS technology, paving the way for innovative applications and advancements in the field.

SWAP Hub is developing a CMOS Discovery Platform that will allow hub users to heterogeneously characterize integrated BEOL device arrays under baseline and radiation environments. In addition, the Discovery Platform supports the integration and array-scale characterization of emerging devices by offering a unique, interposer-based option. In this case, emerging devices are fabricated on a large, planar substrate that is compatible with typical university labs, and supports micron and nanoscale devices processed under nonideal processing conditions.

SWAP Hub is developing a CMOS Discovery Platform that will allow hub users to heterogeneously characterize integrated BEOL device arrays under baseline and radiation environments. In addition, the Discovery Platform supports the integration and array-scale characterization of emerging devices by offering a unique, interposer-based option. In this case, emerging devices are fabricated on a large, planar substrate that is compatible with typical university labs, and supports micron and nanoscale devices processed under nonideal processing conditions.

Heterogeneous Integration refers to the integration of separately manufactured active and passive electronic components using advanced semiconductor packaging technologies. Within the Swap-Hub we have access to a wide range of packaging technologies which includes a world leading fan-out-wafer-level prototype line based on the DECA MSeries Gen2 platform. In addition to this our packaging capabilities are supported by accelerated life tests such as HALT/HASS, HAST, and thermal cycling as well as advanced Multiphysics analysis tools for thermal management and physics-of-failure reliability assessments.

The circuits and architectures design and test capability area aims to provide design, tapeout, and test support for the SWAP Hub activities and projects. The SWAP Hub will establish and maintain a circuit Intellectual Property (IP) library that contains common digital, analog, and RF circuit blocks, such as computation cores, multipliers, chip-to-chip communication units, analog-to-digital converters, power management units, RF amplifiers and mixers, and oscillators. The IP library will be a hybrid of soft IP (defined at the register transfer level) and hard IP (defined by layout targeting a specific technology node). Additionally, the SWAP Hub circuit testing laboratory contains multiple test equipment units, including signal generators, signal analyzers, and high speed oscilloscopes that are available to the hub member for a usage fee.

The primary goal of the Metrology capability of SWAP Hub is to integrate existing and emerging materials characterization techniques to enable a rich suite of methods in support of yield, reliability, and failure analysis for the projects in our pipeline.

The RF + Power Capability Area of the SWAP Hub provides growth and fabrication expertise for the prototype demonstration of ultra-wide bandgap (UWBG) devices based on diamond, boron nitride, aluminum nitride and gallium oxide. Material properties (carrier concentration, mobility, resistivity etc.) can be extracted by Hall effect measurements up to 500C. High-voltage/high-current (3 kV/100 A) I-V and C-V measurements can be automated with a FormFactor probe station for sample sizes ranging from pieces to 300 mm wafers. A similar FormFactor probe station for RF measurements allows automated on-wafer DC and small-signal parameter extraction up to 110 GHz.

The Trusted and Assured (T&A) Theme provides a set of cross-cutting area capabilities for assessing, enhancing and validating security and trust within microelectronic systems. The T&A infrastructure provides capabilities that allow SWAP Hub participants (i) to assess threats and vulnerabilities within their prototypes, (ii) to integrate security enhancing IP, (iii) to utilize security assessment point tools within EDA tool flows, and (iv) to carry out assessment activities on abstract models of the prototypes, and on fabricated prototypes. Assessment facilities including an FPGA test bed for prototype emulation, as well as oscilloscopes, source-measure-units, automatic test equipment and physical inspection equipment, are available for assessing side-channel leakage and physical and functional vulnerabilities for a usage fee.

SWAP Hub efforts conducted under the Extreme Environments theme address potential threats to electronics that operate in space, strategic or other harsh environments. The environments include settings where radiation (e.g., heavy ions, neutrons, electrons, protons, gamma- & x-ray, and microwave), temperature, or other external conditions pose threats to electronic function and reliability not considered by the commercial microelectronics industry

SWAP Hub’s workforce development mission is to enable a robust, thriving microelectronics industry in the Southwest USA. We enable this by investing in enhancing academic programs aligned with the needs of the microelectronics industry, upskilling & reskilling opportunities for working professionals, digital/virtualized learning experiences, and raising awareness among K-12 students and under-represented communities for career pathways in microelectronics.